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变更通知 |
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| 下表列出了FTDI设备的产品变更通知。 要查看产品更改通知，请单击文档标题。 要保存产品更改通知的副本，请右键单击文档标题并选择“另存目标...”。
所有的编程指南为PDF格式，需要 Adobe Acrobat Reader 要安装软件在查看文件前。
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| PCN 编号 |
受影响的料号 |
变更说明 |
预 计 实 施 日 期 |
| PCN 00001 |
FT232RQ
FT232RL
FT245RQ
FT245RL |
Metal layer change to wafer mask set |
2008-01-30 |
| PCN 00002 |
FT2232C
FT2232L |
Replaced by FT2232D |
2008-03-28 |
| PCN 00003 [internal document] |
- |
- |
- |
| PCN 00004 [internal document] |
- |
- |
- |
| PCN_FT_005 |
FT2232HQ
FT2232HL
FT4232HQ
FT4232HL |
Silicon modifications have resulted in the device being modified to Revision C |
2010-04-15 |
| PCN_FT_006 |
VNC2-32Q1x
VNC2-32L1x
VNC2-48Q1x
VNC2-48L1x
VNC2-64Q1x
VNC2-64L1x |
Silicon modifications have resulted in the device being updated to Revision B |
2010-07-29 |
| PCN_FT_007 |
FT2232HQ_Mini_Module
FT4232HQ_Mini_Module |
Modules have been redesigned to use the LQFP package, replacing the QFN package. |
January 2011 |
| PCN_FT_008 |
FT232RQ
FT232RL
FT245RQ
FT245RL |
The present Rev-B of this device will be replaced by Rev-C of the device. |
April 2011 |
| PCN_FT_009 |
VNCL0-MB1A
VNCLO-PSU-US
VNCLO-PSU-EU
VNCLO-PSU-UK
VNCLO-SHLD1A
VNCLO-START1 |
The name of the Vinculo development module , VNCLO-MB1A, will be changed to Vinco |
April 2011 |
| PCN_FT_011 |
FT200XD
FT201XS
FT201XQ
FT220XS
FT220XQ
FT221XS
FT221XQ
FT230XS
FT230XQ
FT231XS
FT231XQ
FT240XS
FT240XQ |
FT-X series of devices revised from Revision B to Revision C
|
11th June 2012
|
| PCN_FT_012 |
FT200XD
FT201XS
FT201XQ
FT220XS
FT220XQ
FT221XS
FT221XQ
FT230XS
FT230XQ
FT231XS
FT231XQ
FT240XS
FT240XQ |
FT-X series of devices revised from Revision C to Revision D
|
31st October 2012
|
| PCN_FT_013 |
VPROG-1-S-LQFP48 |
VPROG 48 pin socket revised from rev 1 to rev 2
|
13th November 2012
|
| PCN_FT_014 |
FT311D |
Update to enable Android Open Accessory Mode 2.0
|
11th December 2012
|
| PCN_FT_015 |
FT232HL
FT232HQ |
Update to support VREGIN at 3.3V
|
17th April 2013
|
| PCN_FT_016 |
FT120Q
FT120Q |
Update to improve compatibility with D12
|
5th July 2013
|
| PCN_FT_020 |
FT4222H |
Upgrade to improve I2C performance and ease of use
|
14th September 2015
|
| PCN_FT_022 |
VNC2-32Q1C
VNC2-32L1C
VNC2-48L1C
VNC2-64L1C |
Update to add VNC2-32L1C,VNC2-48L1C, and VNC2-64L1C to the list |
July 2016 |
| PCN_FT_023 |
FT600Q
FT601Q |
Update from Rev A to Rev B to fix some functional issues |
October 2016 |
| PCN_FT_025 |
UMFT600A
UMFT601A
UMFT600X
UMFT601X |
Update FT60x to Rev B in UMFT60xx modules |
October 2016 |
| PCN_FT_026 |
UMFT4222EV
UMFT4222EV-B
UMFT4222EV-C |
Update FT4222HQ to Rev D in UMFT4222EV modules |
April 2018 |
| PCN_FT_027 |
VNC2-48Q1B,VNC2-64Q1B |
Update from Revision B to Revision C |
April 2017 |
| PCN_FT_028 |
FT4222 HQ Hi-Speed Quad
SPI / I2C device |
Update from Rev. C to Rev. D,
to improve speed and minor bug fixes |
April 2018 |
| PCN_FT_029 |
FT4222 Programmer Module |
Resolved Power Switch control issues |
May 2017 |
| PCN_FT_035 |
FT602, UMFT602A, UMFT602X |
Updated FT602 Chips to Rev. B and Chips on Development Modules |
Jan 2018 |
| PCN_FT_036 |
FT4222HQ Hi-Speed Quad SPI/I2C device |
Lead Frame Change |
Jan 2019 |
| PCN_FT_036 |
FT4222HQ Hi-Speed Quad SPI/I2C device |
Lead Frame Change |
Jan 2019 |
| PCN_FT_038 |
FT232HQ |
1. Lead Frame
2. Packing Material |
April 2019 |
| PCN_FT_039 |
FT232RL
FT232RQ |
1. Lead Frame
2. Packing Material for FT232RL (Reel) |
Mar 2019 |
| PCN_FT_040 |
FT245RL
FT245RQ |
1. Lead Frame
2. Packing Material for FT245RL (Reel) |
June 2019 |
| PCN_FT_041 |
FT311D-32Q1C
FT311D-32L1C |
1. Lead Frame
2. Packing Material |
June 2019 |
| PCN_FT_042 |
FT312D-32Q1C
FT312D-32L1C |
1. Lead Frame
2. Packing Material |
May 2019 |
| PCN_FT_045 |
FT2232HQ
FT2232H-56Q |
1. Lead Frame
2. Packing Material |
June 2019 |
| PCN_FT_046 |
FT4232HQ
FT4232H-56Q |
1. Lead Frame
2. Packing Material |
June 2019 |
| PCN_FT_047 |
VNC2-32Q1C
VNC2-321L1C
VNC2-48Q1C
VNC2-48L1C |
1. Lead Frame
2. Packing Material |
June 2019 |
| PCN_FT_048 |
FT120T |
1. Lead Frame
2. Packing Material |
Jan 2020 |
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